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Published January 19, 2018 at 257 × 265 in Pravin Mistry, Director – Inventor of MLSE (R)
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Thin Film/Diamond

“Depending on the purity of the product, diamond conducts heat from 3-6 times faster than copper, at rates as high as 2.55 W/m-K, while also exhibiting semiconductor properties. At the very least, inexpensive diamond substrates will be invaluable to the shrinking world of microelectronics, which is seeing growing problems with heat dissipation.”

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  • Hit hard by pandemic, textiles now showing signs of recovery
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  • Why Antimicrobial Fabric Treatments Will Be a Big Part of Our Textile Future—Latest Developments
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